HomeIndustryDevice ManufacturingSolutionsHigh performance on board

High performance on board

OMNIMATE Power - innovative device connectivity up to 50 mm² & latest PCB technology for high currents up to 150 A

 
 

Technology trends – such as energy efficiency, increasing power density or the overall integration of power, signals and data on the same system platform – are both, a challenge for engineering, but also a chance on diversification and innovation. Thus, trends drive growth and attempt to be a decisive factor for an application's success. Obviously, one of these trends is the increasing performance of power electronics.

Due to an ongoing improvement of the manufacturing process, particularly the performance of the PCB strongly has been increased along the recent years. Providing the new LXXX 15.00 high-power PCB terminal, Weidmüller enables the engineer to replace extensive and expensive bus bar constructions up to 150 A by a compact single component for easy wave soldering, simple integration and fast und safe connection.

This does not only result in considerable space-savings but also brings about reduced manufacturing costs.

The higher the current, the higher the impact of the factors

Layout and solder quality have been crucial in realising this solution as they are major influencing factors on the thermal situation. Weidmüller’s investigations and experiences in the field of power connectivity have shown: the higher the current, the higher the impact of the factors influencing the temperature rise of an electrical system. Besides the power loss of the active components and the constructive layout of heat sinks, it is also simple things to consider, such as surface size, cross connection and distance of the wires, the power conducting paths in the board or even pin layout, moulding and current bar design as well as the material of the terminal. Due to the huge mass of high power components and boards, the solder quality depends strongly on the pin design and the soldering heat profile.

Different temperature shapes

The different temperature shapes of a system can easily be determined by thermal imaging. The thermal images of reference test equipment visualise the impact of design and production details – like for example layout or solder quality – on the thermal situation. The left images – with a perfect soldered connection – show a significantly lower temperature, both, on the upper and on the bottom side. To ensure a high soldering quality, the mass of the components require expertise in high current conduction on PCBs

 Thermal images of reference test equipment

Smaller devices at the same or a higher performance level – the key success factor for this is an optimal combination of the latest power PCB technology with high performance connection technology plus the experience and expertise concerning special requirements on high currents. This combination becomes manifest in the new high current PCB connection LXXX 15.00 from Weidmüller.